Intelligent features that automate your inspection
An artificial intelligence analyzer trained with sparse data to recognize wafer defects and features of interest. Once trained, the analyzer can be imported into a production tool and begin to automatically detect and classify defects.
This automation creates highly repeatable inspection results and reduces the chance of operator error.
nSpec PS features a program that compares a die without defects to other dies and reports the position coordinates of all dies with defects, whether they are random defects caused by particles or systematic defect clusters caused by conditions of the photomask and exposure process. The automated system then generates a defect map report of all defects detected on the wafer.